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Interconnects play an increasing role in all electronic and information systems, allowing fast and high bandwidth communication both on-chip and off-chip.
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Synchronization of systems with robust and adaptive clocking systems are
a very important aspect of the most advanced multi-core microprocessors.
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3D technologies are emerging and present great opportunities but also new
challenges in interconnect, thermal issues, mixed-technologies and power delivery.
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Power consumption continues to be a challenge in battery-powered,
wall-powered and now even wirelessly-powered systems. Increased power density
and especially device leakage, leads to increasing temperature which must be sensed
and mitigated both at design-time and run-time.
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Side-channel Leakage and On-Chip Monitors: Power consumption, timing information, temperature, faults and electromagnetic radiation all can be monitored to optimize the system as well as to attack and divulge secret information in the system.
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Finally, computation and communication in the presence of uncertain manufacturing
process, voltage noise and temperature has become a primary design issue.
Test chip manufactured in 45nm IBM SOI, 2011.
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